What Segments Contributes More to 2011 Semiconductor Rise

These days, many research companies have released their latest forecast on  semiconductor industry. Market reports from IHS andWSTS both indicates a little rising on 2011 chip shipments.

2011 might be still a good year for electronic markets though there are many nature disasters across the world. It is said that theglobal semiconductor revenue in 2011 is projected to amount to $325.9 billion, up from $304.1 billion in 2010, according to a newly revised forecast. The previous IHS iSuppli outlook released in April predicted revenue would rise by 7 percent for the year.

Dale Ford, senior vice president for semiconductor market intelligence at HIS said, thanks to the hardiness of the global electronics supply chain, the semiconductor industry is set for a year of solid growth in 2011.

The healthy rise in 2011 comes on the heels of the torrid 32.2 percent increase in 2010 when the market rebounded from the recession-driven downturn of 2009. Following the 7.2 percent increase in 2011, growth will then moderate during the following two years, rising by 4.8 and 4.0 percent, before accelerating to 8.0 percent and 7.5 percent expansions during the next two years.

Let’s come to see what factors have make contributions to this shipment rising.

One factor is theyear’s strongest performers in Semiconductors, Spurred by consumer demand including the 3 segments as follows:

First, also the most important one is the wireless and mobile segments. The strongest semiconductor demand growth in 2011 will be driven by the wireless and mobile segments, led by the proliferation and high demand for devices such as media tablets, smart phones, e-book readers, solid state drives and handheld video game players. Because of this, wireless communications will generate the strongest increase in semiconductor revenue of all chip application markets in 2011, with a 17.6 percent increase.

Second, the mobile PCs field. Despite the popularity of tablets such as Apple Inc.’s iPad, mobile PCs also will be a healthy contributor to semiconductor growth this year. This will help make the data processing category the third-fastest growing semiconductor application market in 2011, with growth of 6.2 percent.

Third, the smaller industrial electronics segment. The much smaller industrial electronics segment will be the second-fastest growing semiconductor application market, with revenue rising by 7.3 percent. Sectors achieving slower expansion this year will include consumer electronics at 3.1 percent and automotive electronics at 3.0 percent.

The other factor is the image sensors that leads market growth. The fastest-growing semiconductor product segments in 2011 will be image  sensors, NAND flashmemory, light-emitting diodes, microprocessors, discrete components, sensors and general-purpose analog integrated circuits.

Because of these products, the collective revenue is projected to rise by more than 12 percent in 2011, with complementary metal-oxide semiconductor (CMOS) image sensors leading all products with 36 percent growth. We should be still optimistic that there is another half good year for semiconductor industry.

Article source: http://www.hqew.net/events/news-article/233.html

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Why They Run Beyond The Microsoft Deal?

While people are still immersing in the excellent experience that brought by Apple’s, Nokia introduced a sleek touch-screen smartphone, the N9, with a useful innovation not found on any competing device, including the iPhone and Google’s Android phones on Tuesday, in Singapore. 

When checking from our domestic cell market, we can see that the N9 has been on the shelf though marked with the tag of coming soon. “It’s optimized for one-hand use,” said Marko Ahtisaari, Nokia’s head of design, whose team devised the N9, which allows users to switch between applications with a thumb, avoiding the need to return to a main menu screen or press a button, something required on both the iPhone and Android phones.

On an 40-mimute interview by NYT, Mr. Elop, a 47-year-old Canadian who ran Microsoft’s Office products division before joining Nokia, used the words “innovate” or “innovation” 24 times to describe Nokia’s such move. It is said that the N9 runs a variant of Nokia’s MeeGo operating system, a product of Nokia’s short-lived venture with Intel, the chip maker. The device was already in the pipeline when he arrived last fall, but Mr. Elop said he saw its potential and accelerated its release, working closely with his design chief, Mr. Ahtisaari, who now reports directly to him. Mr. Ahtisaari said design had a new priority at Nokia, a company traditionally run by radio engineers.

Why Nokia released a new product beyond its Microsoft deal？ Many people would occur with such question. The main reason, we believe may be that Nokia is turning to change the highly embarrassing situation that created by its strongest rival, the Apple. Late last year, the Apple iPhone became the best-selling device at Finland’s leading mobile operator, which traps Nokia in a really embarrassing situation in the cell phone filed. 

In view of the pending Microsoft introduction, Mr. Elop described the N9 as “one step in the journey to demonstrate that we are executing.”

Carolina Milanesi, an analyst for Gartner in London, said the N9 was a “night and day” improvement over its predecessor, the N900. “They have created something that consumers will want,” Ms. Milanesi said.

Mr. Elop suggested that many N9 innovations might be incorporated into the new Microsoft line.

Obviously, Nokia is just trying to do everything they can to call back customer’s attentions that we are still here, we are still competitive and innovative to make more you want.

 Article source: http://www.hqew.net/events/news-article/224.html

2011 Is Expected to Be A Record Year for Fab Equipment Spending

According to Semi’s latest report on semiconductor equipment spending and manufacturing capacity, it said that in 2011, there are an increasing capital expenditure and a growing installed semiconductor manufacturing capacity while Fab construction spending, decelerates this year and in 2012.  Semi’s database tracks spending, capacity and technology node projects for every fab worldwide by company. Spending covers new and used equipment for production, pilot, and R&D fabs, including investments for LED device fabrication.

“2011 is expected to be a record year for fab equipment spending. Since February, some companies have increased capex guidance and, as a result, fab equipment spending should reach an all-time high of about $44 billion. The spending pace is expected to decline 6% to $41 billion in 2012, yet will remain the second highest annual level on record.” said Christian Gregor Dieseldorff, senior analyst of fab information in the SEMI Industry Research and Statistics group.  “However, the number of new volume fabs starting construction is historically low, with potential implications for industry capacity plans in 2012 and beyond.”

SEMI’s database indicates that 17 new volume fabs (including 13 LED fabs) have a high probability (>60%) of beginning construction this year. Excluding the LED fabs, SEMI predicts only four volume fabs will begin construction this year and another four in 2012. The SEMI fab database also now identifies candidates for investment in the potential transition to manufacturing on 450 mm wafers. Sometime in 2012, the industry will likely see initial equipment expenditures for 450mm pilot development. Construction of the first 450 mm ready facilities began last year, and more will begin construction this year. Overall fab construction spending slows this year and in 2012.

The earthquake in Japan on March 11 may have some short-term effect on utilization rates and capacity output, but will not have a significant impact on installed capacity.  Recent Fab Capacity (without Discretes) growth seems to be leveling off to below 10% growth annually.

Installed capacity is expected to increase about 9% in 2011 and 7% in 2011. In 2010, the growth rate in capacity of Foundry fabs surpassed Memory fabs, and this trend is expected to continue in 2011, as Foundry capacity will increase by 13% while Memory capacity will increase by 8%. Growth of LED dedicated fab capacity remains in the double-digits with over 40% estimated in 2011, though lower capacity growth is forecasted in 2012. Memory dominates the worldwide installed fab capacity with a 38% share of the capacity this year, followed by foundries with about a 29% share. 

More spending indicates larger demand from the markets, we believe that there are many chances in 2011 and 2012, however, we have to notice that more expanding also means much harder and complicated competition situation in this semiconductor field. 

 Article source:

http://www.hqew.net/events/news-article/225.html

Low-power and High-speed Solid-state Memory Card for Air Defense

At present, electronic components are playing more and more important rols in defense or aerospace fields. Even no mechanical products can work without the semiconductor parts in this fast developing century.

RunCore Inc. has introduced the  first  generation  of  PMC  solid-state  memory  card (RCH-I-PU3  series  Solid  State  Storage  Card, the product of Hurricane  Series.

Compared with the mechanical parts, the RCH-I-PU3 series Solid  State  Storage  Card has no any mechanical moving parts. With its superior performance, high reliability and  low power consumption,  these products are flexibly suitable for a variety of application environments, and has a great application  prospects  in aerospace, military and defense fields.

In  compliance  with  the IEEE1386.1standard  design, using the Air-cooling standard design, support two types of flash storage media – SLC and MLC, capacity range of the first generation PMC are up to  32GB-128GB(SLC）and 32GB-512GB(MLC) respectively.

RCH-I-PU3  Series  PMC  solid-state  memory  card is using the industrial level of SATA SSD controller, which provides a reliable  ECC  standard.  Using  flash  as  the  storage  medium,  it  has  a  quite  working performance.  The  storage  is  using  a  “Loss  balance  algorithm”  and  “bad  block management techniques” to ensure that the users can access accurately and consistently.

According to the released report, the flash’s life is generally restricted by the number of times of accessing. In order to extend the  life of  the hard disk, one key self-destruction has  integrated  the benefits of “balance of loss of special algorithm” and “bad block management algorithm”, which ensure that the hard disk  read  and  write  cycles  will  cover  all  of  the  flash memory  area.  This  algorithm  can eliminate  the  repeated  operation  in  one  single  memory  area,  which  prevents  the  flash memory blocks in advance by “wear and tear”. It seems this product can cut a lot  of government budget with such a long electronic component replaced circle.

RCH-I-PU3  Series  PMC  solid-state  memory  card  support  software  RAID  feature PCI-SATA bridge chip, and two SATA solid-state memory cell constituted is compatible with 32bit  33/66MHz  PCI  Transfer  Protocol.  It  provides  two  equal  sets  of SATA  SSD  storage spaces, each set of space’s write and read speed is up to 70MB/S. Using different operating system  like Window,  Linux  and Vxworks,  it  then enable  to  do RAID0  (Stripe)  and RAID1 (Mirror)  mode  of  data  transmission,  which  also  provides  the  features  such  as  superior performance and data security. Under the RAID0 (stripe) mode of data transition, its speed is up to 120MB/S.

It is said that without power supplied, data in Runcore’s solid state disk storage can still maintain up to 10 years validity. Under any certain circumstances, stored data can extend the retention period and there would not be any sudden loss.

It seems this product can cut a lot  of government budget with such a long electronic component replaced circle. 

Article source: http://www.hqew.net/article/showdetails-article-220.html

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Innovative Compensation Techniques Help To Improve Our Performance

“We ensure performance stability and repeatability at high temperatures through the design of the signal-processing circuitry in the ASIC,” explains Wayne Meyer, marketing and applications manager for the Analog Devices MEMS and Sensor Technologies Division.

These days, ADI company has released a new product called ADXL206. This semiconductor device is a dual-axis iMEMS accelerometer which can tackle tasks with its signal-conditioned analog outputs. It performs measurements while drilling, at several hours in each well during its creation, and continuously keeps on running. The packaged product integrates the sensing element and the signal-conditioning circuitry on a single monolithic chip.

The accelerometer, which is well suited for geological drilling tools and other extreme high-temperature industrial fields with its excellent stability, measures acceleration over a full-scale range of ±5 g with a resolution of 1 mg. It also measures both dynamic acceleration such as tilt and static acceleration such as gravity, all while operating from –40°C to 175°C. Shock survival is rated at 3500 g. All of this comes in a RoHS-compliant (Restrictions on Hazardous Substances) eight-lead side-brazed ceramic dual-inline package that’s just 13 by 8 by 2 mm.

Although the upper operating temperature of 175°C is guaranteed for 1000 hours, the sensor can recover 100% of the measured data beyond that limit, at diminished performance, thanks to innovative compensation techniques. This is ensured through the design of the signal-processing ASIC whose size is minimized, compared to other competitive approaches that usually employ large and bulky circuitry that constrains maneuverability in down-hole operations.

“As designers put together smart drilling systems that go miles and miles under the earth’s surface, they are challenged to balance power and space requirements against the need for more information,” says Pam Aparo, segment marketing manager for instrumentation at Analog Devices. “The ADXL206 is not only extremely compact, but it also lower power consumption by an order of magnitude from over 10 mA to under 0.5 mA per axis.”

The accelerometer’s bandwidth is user-selectable with capacitors at the chip’s X and Y outputs. A bandwidth of 0.5 Hz to 2.5 kHz is available to suit the application.

“Instead of using additional temperature-compensation circuitry, innovative design techniques have been used to ensure that high performance is built in. As a result, there is essentially no quantization error or non-monotonic behavior, and temperature hysteresis is very low, typically 2 mg over the entire operating-temperature range of –40°C to 175°C. This product is once again demonstrates the ADI’s leadership in the field of the high-performance MEMS inertial sensors.” Added Wayne Meyer.

Key Features of DXL206 iMEMS accelerometer:

1. –40 °C to +175 °C temperature range

2. 1 mg resolution at 60 Hz

3. Low power: 700 µA at VS = 5 V (typical)

4. High zero g bias repeatability

5. High sensitivity accuracy

6. 3500 g shock survival

Article source: http://www.hqew.net/article/showdetails-article-217.html

Intel: It Is Expected to Be Able to Run As Much As 37 Percent Faster

Intel，an American global technology company and the world's largest semiconductor chip maker，announced on Wednesday that it had again found a way to make computer chips that could process information more quickly and with less power in less space.

As we all know, a computer chip also known as an integrated circuit or a small electronic circuit became popular in the latter half of the 20th century because of their small size, low cost, high performance and ease to produce.

Computer chips are in small size and are made of semiconductors that are usually composed of silicon, on which several tiny components including transistors are embedded and used to transmit electronic data signals. The first modern computer chip was developed in 1950s, and it used quite few transistors, but as time went on, the amount of transistors that could be attached to the computer chip increased, the subsequent electronic components in the computer contains thousands of tiny transistors, leading to the computer microprocessors.

The early transistors were built on a flat surface. But like a real estate developer building skyscrapers to get more rentable space from a plot of land.

over the past decade, Intel has been studying 3-D or "three" transistors, other companies are testing similar technology. Today’s statement is worth attention, because Intel have found the way to mass production of cheap transistors. 

Although the company did not give technical details about its new process in its Wednesday announcement, it said that it expected to be able to make chips that run as much as 37 percent faster in low-voltage applications and it would be able to cut power consumption as much as 50 percent.

But analysts believe that half a century the invention of the integrated circuit, this is the silicon transistor design one of the most important advances. Semiconductor industry veteran, VLSI Research CEO Danhaqisen (Dan Hutcheson) said: "I was surprised, this is definitely revolutionary. " 

Moore’s Law predicts that computer performance can be doubled every 2 years, since the number of transistors on a chip doubles about every 2 years. Whatever the law remains in force, some comments from china says that this is the real core technology. 

Article source: http://www.hqew.net/article/showdetails-article-156.html

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Technologically Prevent Food Poisoning Events

Recent weeks, due to the prevalence of unsafe milk powders and other chemical pollution food in China and the outbreak of “poison cucumber” induced hemolytic uremic syndrome in some European countries, food safety issues are getting increasing concerns all over the world.

 

Besides the chemical ways, science electronic also focus more attentions to provide technologies solutions that help to solve such serious food issues.

 

Today’s technique is aimed to help customers to know more about the food that would stay in their stomachs. It is not a much innovative technique in current electronic component industry, but its Working principle and practical functions are worth references by law enforcement. It is called RFID.

 

RFID, short for Radio Frequency ID, tags have found their way into a wide variety of applications. These pellets, which are often roughly the same size as a grain of rice, can help us to be reunited with our lost pets, keep towels inside the hotel, and keep big box stores shipping the right boxes to the right places at the right time.

 

In time you may even find them inside your own stomach. At least they will be there if Hannes Harms has anything to say about it. Mr. Harms, who is currently a design engineering student at the Royal College of Art in London, has designed the NutriSmart system. The system is based on edible RFID tags that will tell you more about your food then you ever wanted to know.

 

The system would be able to not only give you complete nutritional data on the food that you are about to consume, but able to tell you the entire supply chain behind everything that you are putting into your mouth. While this could be good news for diabetics, people with serious food allergies, and vegans, it also has applications outside of the medical.

 

A properly equipped refrigerator would be able to give the user a look at everything that the box contains, and when it is going to go bad.

 

The system can also be paired with a “Smart plate”, which would allow the embedded reader in the dish to tell you about the caloric and nutrition information about what you are eating, as well as how many miles it has come to be on your plate. The data can then be sent to your cell phones, via a Bluetooth connection.

 

However, as for how to deal with the used RFID tags, no relevant argument are provided yet. Also, the system now is not available in medical field.

As for the Chinese market, we may be use the technology to solve the quality problem first, then consider the nutritional problems.

 

 

 

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Key for Intelligent Television—Technical Innovation

2011 is the important year for intelligent televisions, which can be reflected from an phenomenon that quite an amount of manufacturers post their intelligent televisions this year. Along with the traditional televisions attaching with more and more IT attributes, more IT companies have joined the competition in intelligent television market, such as, Intel and AMD Microsoft and Lenovo which are quite familiar to our consumers.

Firstly, intelligent TV means hardware technology upgrade and revolution. Only by equipped with industry-leading high configuration and performance, can intelligent televisions run large 3D game and various software programs smoothly. Although intelligent television is one important part of IT products, its market is quite different from the traditional IT products market. Intelligent television market is not technology driven market, but function driven market. The manufacturers who join this market, especially the IT manufacturers, have to set up the business model which is various from the traditional IT products market.

As for the traditional IT products, represented by PC, the upgrading of their technology will drive the increase of the whole market, and each round of the growth will lead to the upgrade of hardware and software greatly, which is difficult to find in the intelligent television market.

Intelligent TV market changed from traditional TV market. When choosing the intelligent televisions, the consumers concern some points as follows, “what kind of functions can this TV provide? Are these functions practical? Is it convenient to use these functions?” By comparing with these points, consumers consider less about some other points, such as, “how to realize these functions? Does it adopts Android or Windows system? Intel or AMD processor? Dual-core or quad-core?”

In the future, television will gradually develop into an open business bearing platform which becomes the family intelligent entertainment terminal for the consumers. Under the environment of three networks cooperation, based on its open software platform, intelligent television will be the important bearing platform for family multimedia. With the continuous innovation, intelligent television which is full of practical functions becomes more and more powerful today. Meanwhile, it is a right way for the future development of TVs.

You can also check more electronic products on this page, which will tell you more about current electronic products like smartphone,ttv and so on.

Article source:

http://www.hqew.net/article/showdetails-article-178.html

Top 10 Great Android Features that iOS System Don’t Have

On May 14, in the blog, Lifehacker, someone expressed as follows, “we love both Android and iOS, but the open nature of Android just means it can do things others just can’t.” Then, the blogger further listed out the top ten Android features which the iPhone don’t have.

1. Controlling Your Phone through Your Computer

Through some applications, users can control Android phone from the computers, including sending texts from Chrome or accessing any of its other functions from a web browser. Although users can get into iPhone through VNC, it is quite different as using a separate app that accesses its own functions.

2. True App Integration

Perhaps, Google Voice may finally be available for iPhone, but the iPhone experience might never be the same as it is on Android. Other iPhone apps always unfold the default dialer and visual voicemail apps to the users. Therefore, if the users want to use Google Voice all the time, you must manually operate it by yourselves. While on Android, apps like Google Voice are integrated directly with the operating system. If the users want to call somebody through Google Voice, you can call anyone from the phone’s dialer through Google Voice. This true app integration makes using phone, SMS, voicemail and browser apps work well on Android.

 

3. Wireless App Installation

While browsing for new apps, the users usually hope they can download these apps directly. As for iPhone users, they need to download these apps into their phones firstly, or plug the apps into iTunes to sync them all over. However, Google’s Android has no problem in this aspect. By finding the apps, the users can click the install button, and then the apps are all on your phone directly.

 

4. Flash

Surfing the internet without installing flash, the users will find its importance. The users can gain more information after installation of flash, whether accessing fully flash web sites, watching flash videos, or playing games. Without having flash installed on your phone, you would be difficult to experience the integrated functions of the internet.

5. Custom ROM

The third-party apps of Android can provide the users various advanced features. One point should be mentioned, the whole Android operating system is open source which allows the users to design by themselves. Whether using Cyanogen Mod or MIUI Rom, the users can tweak their Android experience with little limitation. Through the trigger, users can undertake large system adjustment, such us, speeding up phones or features like FM radio.

 

6. Removable Storage and Battery

It has nothing to do with Android software, but Android’s open nature allows for quite a few hardware advantages as well, like upgrade your battery and SD card. If iPhone users find it is out of storage space, they could not store contents on their phones continuously. But as for Android phones, users can put into a new SD card to solve this problem. Meanwhile, through changing the batteries, Android phone users can make the phones go longer without charging.

7. Widgets

Although widgets take up some space, they bring in lots of convenience. If you have jail broken, iPhone users can use widgets as well. However, you can only put them on your lock screen, but not the actual home screen.

8. Custom Home Launchers

After jail broken, iPhone users can customize their home screen, while the degree for its customization cannot be compared with Android system. Through third party launchers, users can add different apps in Android home screens, including gestures, different shortcuts and even low-level settings.

 

9. Tasker

One of the most powerful, useful apps of Android is its tasker. Through tasker, users can turn settings on or off for some certain applications, which is only for Android.

10. Alternative Keyboards

On Android, it offers various keyboard choices, including Swiftkey, Swype and 8pen and so on. As for the problem that lots of people don’t like to type on a tiny phone keyboard, Android provides users many other options. Although iPhone has alternative keyboards as well, these keyboard choices are separate applications which require users to import text to another program.

An Overview on Graphene’s Latest Developments in Electronic Field

Graphene is an allotrope of carbon, whose structure is one-atom-thick planar sheets of sp2-bonded carbon atoms that are densely packed in a honeycomb crystal lattice, therefore it is considered as the future silicon. 

In 1970s, Scientists began making flakes of graphene, the atomic-scale lattice of carbon atoms. 

As an ultra-thin material, Graphene has a host of promising applications, from high-bandwidth communication to a new generation of low-cost smartphone and television displays.

One promising application for graphene is in making new parts of the radio-frequency spectrum available for consumer electronics applications, said Richard Doherty, president of Envisioneering Inc., an industry consulting firm.

“It allows you to tame a spectrum that before was the wild, wild West,” he said. For example, it might make possible a new class of Wi-Fi-style communications gear for wireless applications, or allow set-top cable boxes to be redesigned to send and receive ever-larger amounts of high-resolution video and data.

According to Newest study on Graphene material , IBM, the computer technology giant said on last Thursday that they have designed high-speed circuits from such material. Moreover, a report from the journal Science tells us that IBM’s G circuit is known as a broadband frequency mixer that was built on a wafer of silicon. Such circuits are widely used in all kinds of communications products by shifting signals from one one frequency to another.

Mr. Doherty added that display manufacturers were especially interested in graphene because the current wave of displays based on OLEDs, or organic light-emitting diodes, have limited lifespans.

In the past I.B.M. has created stand-alone graphene transistors, but not complete electronic circuits. However, this time the I.B.M. researchers describe a demonstration in which they deposited several layers of graphene on a silicon wafer, then created circuits based on graphene transistors and components known as inductors. They demonstrated frequency mixing up to speeds of 10 gigahertz.

Phaedon Avouris, IBM’s leader chemical physicist said while I.B.M. was now able to build circuits from the material, it was still learning reliable ways to make large quantities of graphene film. It is now possible to heat a silicon carbide wafer to about 1,300 degrees Celsius (nearly 2,400 Fahrenheit), causing the silicon atoms on the surface to evaporate and the remaining carbon atoms to rearrange themselves into the hexagonal graphene shape. 

Meantime, it is still a problem for IBM to get the graphene due to the high cost of the silicon carbide wafers according to Dr. Avouris’s comment.  

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Sharp Growth of the Shipments of PCB Industry in Late June

As PCB industry season, late June, is coming soon, PCB manufacturers predict that the shipments will grow greatly in Q3 of this year. Actually, whether it will increase or not, people will find out the fact at least in the late June. Since solar energy industry has sagged a lot in Q2, it is expected that it will increase most in Q3. By contrast, some other industries may grow less than it, such as, the smartphones, tablet PCs, photovoltaic panels. Meanwhile, because of the suppliers’ control of the shipments, NB market is only slightly better now.

First of all, the order of phone board is not so significant in the short-term, but it is expected to grow rapidly in Q3. Some mobile phone manufacturers will launch new models in the Q3, so they order less phone board in Q2.

Additionally, the Europe mobile phone manufacturers who take up the largest global market share are adjusting their business strategies, which lead to the decline demand of phone boards recently. As the Europe mobile manufacturers will release their fifth generation of mobile phones in Q3 with the high price, which will consume lots of HDI production capacity as well, it is supposed that manufacturers will benefit a lot. According to the industry chain information, the shape and design of the third generation tablet PCs are totally different from the second generation’s. Perhaps, they will be sold in the market at the same time, and the second generation PCs will not be replaced by the third generation PCs at once.

Moreover, NB market situation has been improved. However, because of little profits, NB board suppliers control the output volume. Since the little profits for NB foundry and NB brand manufacturers, NB board suppliers have regulated the prices many times. But all these efforts did not achieve good response from the consumers, which brought that the sale prices were lower than production costs.

Additionally, in the second quarter of this year, copper foil substrate reduce its price which could further reflect its production costs. In the first quarter, PCB manufacturers have already accumulated some inventory, so they purchase less in the second quarter. Moreover, the recent copper prices fell back from $10000 per ton to $8500 per ton. Therefore, in May, copper foil substrate manufacturers dropped their prices slightly to meet the production cost.

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Article source: http://www.hqew.net/article/showdetails-article-200.html