Audio Distortion Level Indicator

Two type D-IC2 triggers the distribution of the flip by D input/output connected to the role of the distributor. The output of the Q FF1 connected to FF2 clock input. produce a four counter. The output of IC4 and CMOS IC3 control switch. Into each switches allow switches work provided in linear range including bleeder low distortion audio signal. 

The circuit will need a only 1 ma current in the power supply voltage for 5 V, can be increased to about 15 V. 

 

Use the  electronic  map, through a single switch, can choose four independent stereo channel one of them. CMOS of components of the internal switch, in order to avoid cracking, usually in mechanical switch.

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Mobile Phone Camera Flash LED Circuit Diagram

This circuit diagram below is amobile phonecamera Flash circuit diagram at a peak current of the 100-200 Ma. With a AAT3110IGU-4.5 V capacitive charge pump, it rises the lithium battery voltage and stabilizes it at 4.5 V. The AAT3110IGU-4.5V capacitive charge pump provides 4.5 V working voltage and 100-200 mA peak current to the EL-61-25UWC Flash LED, and together with the FDG335N MOSFET as the flash lamp switch , the peak current flows through it to form the loop.

For this charge pump, the input filter capacitor is 10 uF, the output filter capacitor is 4.7 uF and the dc capacitor is 1 uF; as for the ESR, the small ones are X7R, X5R ceramic capacitors and the RB is Flash LED balancing resistors, the RF is the adjustment resistor for peak current, it can set the peak current value when changing the RF value. 

Data provided by http://www.hqew.net/events/news-article/2179.html

Japanese Electronics Flagging Components Manufacturers Suffer

Natural disasters last year constantly, especially in March a earthquake tsunami, make Japanese electronics industry suffered a severe blow, Japanese electronics industry in the past has been an pull postwar Japan the high-speed economic development the important power, had made made in Japan  in the world market of good public praise, now Japanese electronics industry in jail, it's hard to see over time.

In early February Japan panasonic, SONY and XiaPuSan home electric company revealed last fiscal year performance expectations, after-tax net loss will be as high as 1.29 trillion yen, financial situation is already on all signs debacle. And panasonic is Japanese manufacturing industry in the history of the value of the mortgage losses, losses have as high as 780 billion yen.

Faced with such dilemma for Japanese electronics enterprises have make corresponding rectification, trying to reverse the current predicament. By the end of last year, SONY, Toshiba and Hitachi has set up a file in the middle and small LCD screen on the cooperation agreement. Since February this year, panasonic, Fujitsu and renesas electronics also start the system LSI with semiconductor, namely large scale integrated circuit negotiating business, to expand the scale of industry and competitiveness. On the other hand XiaPuZe for intelligent mobile phone is devoted to the development of small and medium-sized LCD screen.

Although at present, electronic enterprise are in the positive is make corresponding countermeasures ease its current predicament, but no good achievements and huge losses in the short term it is difficult to ease, and now the global electronic market competition becomes increasingly fierce, carelessly a bit was knocked out by the market, facing the predicament Japanese electronics industry can safely through tough times is still not clear.

Another Japanese many enterprises have been brewing transformation, also give corresponding before the industrial electronic components manufacturers to bring a lot of problems, the former electronic components would cause certain backlog, but the corresponding suppliers if not to follow transition, will inevitably difficult again cooperation, so to corresponding electronic components industry in the short term is likely to cause certain unrest..

DATA PROVIDED BY http://www.hqew.net/events/news-article/2168.html

IC Competition to a Higher Level

IHS iSuppli senior analyst GuWenJun in January 2012, we expect China IC design to to 2015 will be reached 10 billion us dollars, China to the needs of the IC and IC local supply capacity is still there is a huge gap

IC designservices company core the Original (VeriSilicon) the chairman and chief executive of DaiWeiMin think, now the company level of integration more and more high, the emerging OSO (Original Solution Orchestrator, entrust solutions coordinator, is not long ago put forward the concept of Gartner.) Than ODM (the design by), OEM (commissioning) high level, mainly in integrated applications and content. This level of integration not every enterprise can do. Such as apple product success, reflected in the application, and content of the rich, so hardware can do well, but the rich content is not easy, so samsung and China Taiwan's some manufacturers up go not too. Now Google (Google) also talking about the content, the acquisition of the Motorola hardware. In China, if baidu and alibaba going down may be very bad, because there is a user base.

China's Taiwan PC is very strong, but to smartphone/pad (tablet computer) has had problems, the reason is chips/chipset is very strong will not be enough, and lack of content. China's mobile phone have realized that do millet content, not just the phone itself.

China's Taiwan PC is very strong, but to smartphone/pad (tablet computer) has had problems, the reason is chips/chipset is very strong will not be enough, and lack of content. China's mobile phone have realized that do millet content, not just the phone itself.

EDA (electronic design automation) tools and IP (intellectual property rights) suppliers of Synopsys global vice President and President, Asia Pacific PanJianYue also believe, in general, the Chinese IC design company more energetic, of course, the largest base and relying on China's market. Another reason, on average, domestic design company was set up in that time is short, the intellectual property (IP) and the accumulation of design will be a bit less, so everyone also dare to more using new techniques. "At the moment I see in Asia, when a new technology, such as 40 nm out the wave came out, according to the statistics, we the 40 nm design company, the number of mainland China is walking in other Asian countries/regions of the front, which means the mainland of China company USES the advanced technology than the number of Chinese Taiwan area or South Korea. (note: of course enterprise, such as the middleweight samsung, Taiwan LianFa technology (MTK) have a lot of branch departments do at the same time.)" visible, Chinese companies are more actively to adopt new technology. This from one perspective, is "Chinese company on new technology more sensitive."

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TSMC Gets us Win

On Feb. 21st, Samsung touted its new 32 nm high-k metal gate process, which showing features it hopes might win customers over from a supply constrained TSMC. 

While presenting its upcoming 32-nm quad-core mobile processor ostensibly, Samsung spent much of the time presenting its new process, which uses dynamic thermal management and body bias techniques for a significant 40% performance increase over its 45-nm Exynos chip. 

Intel and Globalfoundries have been shipping chips with HKMG for a while now, but with Samsung and TSMC joining the fray, the fab playing field is somewhat equalized. 

With the industry bracing itself for a tight supply of 28-nm from TSMC, Samsung’s 32-nm process and excess capacity manufacturing facilities could prove an attractive alternative to the likes of Nvidia, or even AMD. 

Analysts believe TSMC would give priority to customers like Apple or Qualcomm for the 28-nm process, which would make it difficult for smaller players to get the supply they needed. Samsung is not supply constrained, and the difference between a 28-nm process and a 32-nm process using HKMG is fairly marginal in terms of the end result. 

On the other hand, some in the industry still have qualms over using Samsung as a foundry, both because the firm competes with almost every one of its potential customers and because its fabrication capabilities are still widely untested. 

Those capabilities were being put under the microscope on Feb. 21st, with Samsung also talking up its dynamic thermal management system for mobile SoCs, as well as power gate technology for every CPU and even inside the GPU, allowing power to be switched off, cutting leakage at the source. 

Body Biasing would also give Samsung a differentiating factor from the likes of Intel, which doesn’t use the technology. Body Biasing can be used to either speed up a transistor when full throttle is needed, increasing leakiness slightly, or it can slow the transistor down, stemming leakage for a more optimal low power state. 

However, whether customers will be enticed or not remains to be seen. 
This data is provided by hqew.net 

MediaTek’s Chipset will Drive the Shipment of Smartphones

MediaTek Inc was founded on May 28, 1997. It is headquartered in Hsinchu Science Park located in Hsinchu, Taiwan. Its sales and research subsidiaries are located in China, Singapore, India, Japan, South Korea, USA, Denmark, and England. It is a fables semiconductor company, which is specialized in designing and selling components. The components are used for wireless communication, optical storage, GPS, high-definition digital TV and DVD products. 

The latest silicon chipset platform of MediaTek has been developed for mid and entry level Android smartphones. The MT6575 platform owns a 1GHz ARM Cortex A9 processer, 3G/HSPA modem. It runs the latest “Ice Cream Sandwich” Android 4.0 release. For mid range smartphones, the MT6575 platform supports 720p high definition video playback and recording with an 8MP camera and qHD (960x540) high resolution displays via a PowerVRTM SGX Series5 GPU (graphics processing unit) from Imagination Technologies. 

Cortex A9 processor has powered many updated and highest performance smartphones. Cortex A Series processors’ improvement into lower cost, mainstream mobile device can offer a significant uplift for the user experience. The shipment of smartphone is expected to be 551 million with this segment in the year of 2016. Approximately 75% of those entry and mid level smartphones are expected to ship to new emerging markets. The entry level smartphones with smaller display sizes, lower resolution, less memory and reduced multimedia requirements are also available with the chipset. The latest smartphones offered by many of MediaTek’s leading customers also use the MT6575. In the first quarter of 2012, the first smartphone models based on this new platform will appear on the market. 

WinSystems Power Supply Overview

WinSystems has introduced two small, convection cooled, AC/DC power supplies for embedded systems. One is the PS-RS25-5, which is a 25W unit capable of supplying +5Vdc at 5A while the 50W, PS-RS50-5, supplies +5Vdc at up to 10A. The short circuit and overvoltage protection will recover and return to normal automatically after the fault is removed. Both power supplies support 88 to 264VAC input from 47~63 Hz so that they can operate on AC mains in the world. The units operate from -20° to +70°C requiring no fan. 

The units are certified with EMI, and EMC standards. Both are UL60950-1 and TUV EN60950-1 approved. For EMI and conduction and radiation, each unit complies with EN55022 (CISPR22) Class B. Additionally both power supplies are compliant with EN61000-4-2, 3, 4, 5, 6, 8, 11: ENV50204, EN61000-6-2 (EN50082-2) heavy industry criteria A for EMS immunity. The smaller PS-RS25-5 measures only 79 x 51 x 28mm. The slightly larger PS-RS50-5 measures 99 x 97 x 36mm. 

Four different ordering options are provided for each power supply. These options come with a USA standard AC plug. The variations are defined by the DC harness for WinSystems’ embedded SBCs that conform to the PC/104, EPIC, EBX standards or with no DC harness at all. 


This data is provieded by the largest IC part inventory of www.hqew.net

Introduction of ADP5037, 300mA LDO with buck regulators

The ADP5037 from Analog Devices, Inc., a company defines innovation and excellence in signal processing, combines two high performance buck regulators and two low dropout (LDO) regulators in a small, 24-lead 4 mm x 4 mm LFCSP to meet demanding performance and board space requirements.
The high switching frequency of the buck regulators enables tiny multilayer external components and minimizes the board space. When the MODE pin is set high, the buck regulators operate in forced PWM mode. When the MODE pin is set low and the load is above a predefined threshold, the buck regulators operate in PWM mode. When the load current falls below a predefined threshold, the regulator operates in power save mode (PSM), improving the light-load efficiency.
The two bucks operate out of phase to reduce the input  capacitor requirement. The low quiescent current, low dropout voltage, and wide input voltage range of the ADP5037 LDOs extend the battery life of portable devices. The ADP5037 LDOs maintain power supply rejection greater than 60 dB for frequencies as high as 10 kHz while operating with a low headroom voltage.
Regulators in the ADP5037 are activated though dedicated enable pins. The default output voltages can be externally set in the adjustable version or factory programmable to a wide range of preset values in the fixed voltage version.

Features
• Main input voltage range: 2.3 V to 5.5 V
• Two 800 mA buck  regulators and two 300 mA LDOs
• 24-lead, 4 mm x 4 mm LFCSP package
• Regulator accuracy: ±3%
• Factory programmable or external adjustable VOUTx
• 3 MHz buck operation with forced PWM and auto PWM/PSM modes
• BUCK1/BUCK2: output voltage range from 0.8 V to 3.8 V
• LDO1/LDO2: output voltage range from 0.8 V to 4.75 V
• LDO1/LDO2: low input supply voltage from 1.7 V to 5.5 V
• LDO1/LDO2: high PSRR and low output noise
Related News: How to Identify the Faults of Diodes
Exploring Materials Functionality on the Single Defects Level
This data is provided by http://www.hqew.net/events/news-article/2156.html

How to DIY a Miniature Earphone

If you are interested in DIY electronic products, you can't miss reading this article because it is to show you how a miniature earphone is made. Now, let's begin!

Below is the circuit diagram of the miniature receptor.

     

The mini receptor that is the miniature earphone is only a quarter of a coin. Most of the materials on surface are 0402 resistor and  capacitor. Therefore, the welding requirements are high.

On the left is a  connector  of a charger and it is used for micro lithium battery charging. On the right is an inductance made by oneself. The middle is chip TDA7021.

Below is an earphone mic. Take it apart and put a board and battery into it.

 

The lithium battery (3V) and outer skin of the earphone are as below picture shows.

 Please see the below chart. How small the earphone is!

Put the receptor circuit board into the outer skin of the earphone. The underneath is the earphone speaker, middle is battery and the up is receptor. (As below)

Below is the diagram for PCB's top layer of the miniature receptor.

Below is the diagram for bottom layer of the miniature receptor.

This miniature receptor consists of double layer PCB. Drill a hole as slim as your hair in the PCB. You need to grind the 0.5mm swivel to 0.22mm. Be careful for it is so easy to broken.

Finally, the miniature earphone is completed.

Related News: How to Add A USB3.0 Interface to Your Old Notebook

                             How to Choose the Right Thermal Materials for LED

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We Are Changing from Made in China to Create in China

Along with the increasing improvement and popularity of the Mobile Broadband Technology, smartphone has made it undisputable leadership with its unique advantages. However, the smartphone giants like Apple and HTC, etc. have been dominated the cell phone market especially the high-end smartphone field for long time. The Chinese cell phone manufacturers are just marked by "made in China". Can't the Chinese cell phone manufacturers be outstanding on the international stage? Can't they "create in China" instead of "made in China"?

At CES2012, the Chinese cell phone manufacturers had been successfully attracted the participants' attention and made users be hopeful for Chinese cell phone. Lenovo displayed its first smartphone together with  Intel, ZTE exhibited its full series of LTE products and Huawei showed the smartphone code name "Ascend P1 S" which is the slimmest in the world. All of these represent that "create in China" is rising abruptly and global users have seen Chinese cell phone reaching the international level.

Huawei's smartphone Ascend P1 S has created a new world record of smartphone's thickness. The phone packs in a 4.3-inch Super AMOLED display and has a dual-core 1.5 GHz processor. In addition, it has rear (8-megapixel) and front (1.3-megapixel) cameras and runs on Android 4.0, Ice Cream Sandwich. It offers 1080p video recording and the battery is 1800 mA. It is amazing that the phone is so powerful even though it is such slim. The slimmest gadget compares favourably with iPhone 4S.

As the first enterprise in China that enters the field of high-end cell phone, Huawei has demonstrated its technical strength by releasing Ascend P1 S which is the symbol of the company enter the high-end smartphone market. Apparently, Huawei is  manufacturing  an ultra-thin phone while the hidden facts are the company's innovation and exploring spirits.

The release of Huawei's Ascend P1 S not only means that Huawei becomes world's top brand but also "create in China" is going toward the world. What's more, Chinese cell phone appears to talent show itself on the international stage.

Let's wait for more creation and innovation from Chinese cell phone manufactures patiently.

Related News:ST to Launch the Advanced Chip STOD03A for Smartphone Display Screen
                           Summary of Mobile Phone Manufacturing Giants in 2011

Which Type of Component Can Replace the LM358

The LM358 is a most needed component on IC market, but most of us do not know that the there are many other types of IC can replace it, the list is here:

LM358 Circuit diagram.

6300565 1027-4231 1175-7911 1175-8000 1217-9024 152921 153568 154581 160832 195606 23319802 23904303 23904391 2904D 3130-3167-909 442-728 46-13279-3 46-13297-3 4835-209-87079 4835-209-87262 5190507A39 5190507A40 5190528A01 51X90266M5 51X90507A39 51X90507A40 6122850001 6122850003 6562 8-759-135-80 8050358 905-1238 905-658 AN1358 AN6562 B0347500 BA10358 BA728 C061702 C358C CA2904E ECG928M EW84X232 EW84X233 GL358 HA17094PS HA17358 HA17904 HA17904PS IR9358 LA6358 LM258JG LM258N LM258P LM2904J LM2904JG LM2904N LM2904P LM358 LM358AN LM358AT LM358J LM358JG LM358N LM358P MX-5679 NE532AN NE532N NJM2904 NJM2904D NTE928M QC0069 SK3692 TA75358P TA75558S TA75558S-1 TCG928M UPC358 UPC358C UPC358P VHIIR9358//-1 VHITA75558S-1 X440029040 ......


This data is provided by the largest ic component inventory platform http://www.hqew.net 

DisplaySearch: Tablet PC Shipments to Break 380m Units by 2017

According to the latest Tablet PC market analyst for the first quarter from market research firm DisplaySearch, Tablet PC shipments are estimated to break 380 million units by 2017.

The reasons for why the Tablet PC shipments will increase dramatically are including the steady growth of the mature market and the strong demand in the emerging market. The Tablet PC shipments appear to post over 46% of global shipments by 2017, compared to 36% in 2011.

In the emerging market, Tablet PC market grows rapidly but the main shipments are not from famous brands. Hence the sustainable growth is uncertain, in light of RicharShim, senior analyst of DisplaySearch. However, some famous manufacturers are starting to invest into the market. With their reputation, the market will be driven to be flourishing.

Since the new and old brands are brought in, for example, Aakash enters India market and Dell enters Chinese market, the competition in Tablet PC market is getting fiercer. The penetration rates of Chinese and  Asia-Pacific  markets hold the top spot in the emerging market until the price is lowered and sales channel is widen, some countries, such as Brazil, India, Russia garner increasing market share. Moreover, some countries like Turkey, rectify and reform the education system, such as implementing the FATIH project. Consequently, besides personal use, Tablet PC becomes more and more important in many other fields.

The emerging market grows along with the low price competition which will offer important opportunity to those who can provide optimized performance and lower consumption, in addition, cut the price of equipment to be less than USD 100, JimMcGregor, the Chief Technical Analyst of NPDIn-Stat.

As the market develops, the specifications of Tablet PC are getting continuous improvement. The  Tablet PC  which has more subtle resolution will feature ideal multimedia experience. DisplaySearch estimates the resolution and pixel will be higher in the coming seasons. The penetration rate of the products with 200-300ppi will reach 30% and 47.5% in 2012 and 2017 as the charts below.

Related News: About 35 Percent USA Netizen Will Use Tablet PC Monthly in 2014
Research Company Forecasts 100 Million Shipments in China PC Market

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What IC Design Firm to Work: IC Design Firm Ranks 2011

For many IC part market participants participants, the 2011 is kind of hard year, we got a lot and also lost a lot. Anyway, we have to move on for the new 2012, there are many guys are expecting to enter the IC design industry. So, let's see what companies we can realized our dreams there. 

1 Spreadtrum Communications, Inc.


2010 Revenue: USD300 million 2011 Revenue: USD670 million

Spreadtrum is a fabless semiconductor company that develops baseband and RF processor solutions for the wireless communications market. Spreadtrum combines its semiconductor  design expertise with software development capabilities to deliver highly integrated baseband processors with robust multimedia functionality and power management.
In Apr.2011, Spreadtrum released 40nm TD chip which was the key of the company's high-speed development and the market share of TD field was more than 55%.

2 RDA Microelectronics
2010 Revenue: USD200 million 2011 Revenue: USD300 million

RDA Microelectronics is a fabless semiconductor company that designs, develops and markets radio-frequency and mixed-signal semiconductors.
Although RDA hasn't announced the acquisition of Coolsand, the mobile phone division of Coolsand has become part of RDA. At the end of 2011, Coolsand shipped more than 3kk units each month, just went behind MTK, Spreadtrum and Mstar.

3 GalaxyCore Inc.
2010 Revenue: USD130 million 2011 Revenue: USD200 million

GalaxyCore is a leading semiconductor design company focusing on developing and marketing CMOS Image Sensor applications.
In 2011, GalaxyCore kept high-speed development and launched LCD driver which will be the source of growth in 2012.

4 HiSilicon Technologies Co., Ltd.


2010 Revenue: USD100 million 2011 Revenue: USD180 million

HiSilicon provides ASICs and solutions for communication network and digital media. These ASICs are widely used in over 100 countries and regions around the world. In the digital media field, Hisilicon has already released the SoC and solution for network surveillance, videophone, DVB and IPTV.

5 Fuzhou Rockchip Electronics Co., Ltd.
2010 Revenue: USD60 million 2011 Revenue: USD80 million

Fuzhou Rockchip is a China leading fabless semiconductor company and mobile-internet SOC solution provider.
The company started providing Tablet PC application processor in 2H11 and then basically established the leading position in the area of Tablet PC application processor in mainland China.

6 Parade Technologies, Ltd.
2010 Revenue: USD53 million 2011 Revenue: USD76 million

Parade Technologies is a leading supplier of mixed-signal ICs for a variety of popular display and high-speed interface standards used in computers, consumer electronics  and display panels.  The fabless semiconductor company was founded in 2005 and publicly listed on Taiwan’s GreTai Securities Market (GTSM) in 2011.

7 Montage Technology (Shanghai) Co., LTD.


2010 Revenue: USD35 million 2011 Revenue: USD70 million

Founded in May 2004, Montage Technology is a leading fabless semiconductor company which engages in IC design, application development and product marketing & sales in the areas of digital enterprise and digital home.
The company's biggest breakthrough is the abrupt rising of DDR3 which shipments exceed 1 million.

8 GigaDevice semiconductor Inc.


2010 Revenue: USD25 million 2011 Revenue: USD65 million

GigaDevice is the leading provider of Non-Volatile Memory (NVM) devices, is the first fabless company engaged in advanced memory and related chip design in Mainland China established in 2005. GigaDevice provides a wide range of high speed and low power NOR Flash memory products.
In 2011, the SPI Flash met the demand of low-terminal function phone and the shipments exceeded more than half of the company's total shipments. The application of the flash products almost covers all of the electronic products.

9 On-Bright Electronics (Shanghai) Co., Ltd
2010 Revenue: USD40 million 2011 Revenue: USD55 million

On-Bright Electronics is a public company specialized in high performance analog and mixed-signal IC Design, development and marketing.
Unlike other IC Design firms' high-speed development, the company keeps growth of 30% these years. However, the gross profit is higher than any other firms in the industry.

10 SHANGHAI AWINIC TECHNOLOGY CO., LTD


2010 Revenue: USD30 million 2011 Revenue: USD40 million

Founded in 2008, Awinic Technology specializes in the design of various analog and mixed-digifax which are mainly used to the portable devices like mobile phone. The company develops rapidly and the shipments exceeded 500 million units in 2011.

Related News: Only Semiconductor Market is Hopeful in 2012

                            10 Biggest Events of Global Mobile Phone Market 2011

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