Audio Distortion Level Indicator

Two type D-IC2 triggers the distribution of the flip by D input/output connected to the role of the distributor. The output of the Q FF1 connected to FF2 clock input. produce a four counter. The output of IC4 and CMOS IC3 control switch. Into each switches allow switches work provided in linear range including bleeder low distortion audio signal. 

The circuit will need a only 1 ma current in the power supply voltage for 5 V, can be increased to about 15 V. 

 

Use the  electronic  map, through a single switch, can choose four independent stereo channel one of them. CMOS of components of the internal switch, in order to avoid cracking, usually in mechanical switch.

This data is provided by http://www.hqew.net/events/news-article/2195.html

Mobile Phone Camera Flash LED Circuit Diagram

This circuit diagram below is amobile phonecamera Flash circuit diagram at a peak current of the 100-200 Ma. With a AAT3110IGU-4.5 V capacitive charge pump, it rises the lithium battery voltage and stabilizes it at 4.5 V. The AAT3110IGU-4.5V capacitive charge pump provides 4.5 V working voltage and 100-200 mA peak current to the EL-61-25UWC Flash LED, and together with the FDG335N MOSFET as the flash lamp switch , the peak current flows through it to form the loop.

For this charge pump, the input filter capacitor is 10 uF, the output filter capacitor is 4.7 uF and the dc capacitor is 1 uF; as for the ESR, the small ones are X7R, X5R ceramic capacitors and the RB is Flash LED balancing resistors, the RF is the adjustment resistor for peak current, it can set the peak current value when changing the RF value. 

Data provided by http://www.hqew.net/events/news-article/2179.html

Japanese Electronics Flagging Components Manufacturers Suffer

Natural disasters last year constantly, especially in March a earthquake tsunami, make Japanese electronics industry suffered a severe blow, Japanese electronics industry in the past has been an pull postwar Japan the high-speed economic development the important power, had made made in Japan  in the world market of good public praise, now Japanese electronics industry in jail, it's hard to see over time.

In early February Japan panasonic, SONY and XiaPuSan home electric company revealed last fiscal year performance expectations, after-tax net loss will be as high as 1.29 trillion yen, financial situation is already on all signs debacle. And panasonic is Japanese manufacturing industry in the history of the value of the mortgage losses, losses have as high as 780 billion yen.

Faced with such dilemma for Japanese electronics enterprises have make corresponding rectification, trying to reverse the current predicament. By the end of last year, SONY, Toshiba and Hitachi has set up a file in the middle and small LCD screen on the cooperation agreement. Since February this year, panasonic, Fujitsu and renesas electronics also start the system LSI with semiconductor, namely large scale integrated circuit negotiating business, to expand the scale of industry and competitiveness. On the other hand XiaPuZe for intelligent mobile phone is devoted to the development of small and medium-sized LCD screen.

Although at present, electronic enterprise are in the positive is make corresponding countermeasures ease its current predicament, but no good achievements and huge losses in the short term it is difficult to ease, and now the global electronic market competition becomes increasingly fierce, carelessly a bit was knocked out by the market, facing the predicament Japanese electronics industry can safely through tough times is still not clear.

Another Japanese many enterprises have been brewing transformation, also give corresponding before the industrial electronic components manufacturers to bring a lot of problems, the former electronic components would cause certain backlog, but the corresponding suppliers if not to follow transition, will inevitably difficult again cooperation, so to corresponding electronic components industry in the short term is likely to cause certain unrest..

DATA PROVIDED BY http://www.hqew.net/events/news-article/2168.html

IC Competition to a Higher Level

IHS iSuppli senior analyst GuWenJun in January 2012, we expect China IC design to to 2015 will be reached 10 billion us dollars, China to the needs of the IC and IC local supply capacity is still there is a huge gap

IC designservices company core the Original (VeriSilicon) the chairman and chief executive of DaiWeiMin think, now the company level of integration more and more high, the emerging OSO (Original Solution Orchestrator, entrust solutions coordinator, is not long ago put forward the concept of Gartner.) Than ODM (the design by), OEM (commissioning) high level, mainly in integrated applications and content. This level of integration not every enterprise can do. Such as apple product success, reflected in the application, and content of the rich, so hardware can do well, but the rich content is not easy, so samsung and China Taiwan's some manufacturers up go not too. Now Google (Google) also talking about the content, the acquisition of the Motorola hardware. In China, if baidu and alibaba going down may be very bad, because there is a user base.

China's Taiwan PC is very strong, but to smartphone/pad (tablet computer) has had problems, the reason is chips/chipset is very strong will not be enough, and lack of content. China's mobile phone have realized that do millet content, not just the phone itself.

China's Taiwan PC is very strong, but to smartphone/pad (tablet computer) has had problems, the reason is chips/chipset is very strong will not be enough, and lack of content. China's mobile phone have realized that do millet content, not just the phone itself.

EDA (electronic design automation) tools and IP (intellectual property rights) suppliers of Synopsys global vice President and President, Asia Pacific PanJianYue also believe, in general, the Chinese IC design company more energetic, of course, the largest base and relying on China's market. Another reason, on average, domestic design company was set up in that time is short, the intellectual property (IP) and the accumulation of design will be a bit less, so everyone also dare to more using new techniques. "At the moment I see in Asia, when a new technology, such as 40 nm out the wave came out, according to the statistics, we the 40 nm design company, the number of mainland China is walking in other Asian countries/regions of the front, which means the mainland of China company USES the advanced technology than the number of Chinese Taiwan area or South Korea. (note: of course enterprise, such as the middleweight samsung, Taiwan LianFa technology (MTK) have a lot of branch departments do at the same time.)" visible, Chinese companies are more actively to adopt new technology. This from one perspective, is "Chinese company on new technology more sensitive."

Data provided by http://www.hqew.net/events/news-article/2167.html

TSMC Gets us Win

On Feb. 21st, Samsung touted its new 32 nm high-k metal gate process, which showing features it hopes might win customers over from a supply constrained TSMC. 

While presenting its upcoming 32-nm quad-core mobile processor ostensibly, Samsung spent much of the time presenting its new process, which uses dynamic thermal management and body bias techniques for a significant 40% performance increase over its 45-nm Exynos chip. 

Intel and Globalfoundries have been shipping chips with HKMG for a while now, but with Samsung and TSMC joining the fray, the fab playing field is somewhat equalized. 

With the industry bracing itself for a tight supply of 28-nm from TSMC, Samsung’s 32-nm process and excess capacity manufacturing facilities could prove an attractive alternative to the likes of Nvidia, or even AMD. 

Analysts believe TSMC would give priority to customers like Apple or Qualcomm for the 28-nm process, which would make it difficult for smaller players to get the supply they needed. Samsung is not supply constrained, and the difference between a 28-nm process and a 32-nm process using HKMG is fairly marginal in terms of the end result. 

On the other hand, some in the industry still have qualms over using Samsung as a foundry, both because the firm competes with almost every one of its potential customers and because its fabrication capabilities are still widely untested. 

Those capabilities were being put under the microscope on Feb. 21st, with Samsung also talking up its dynamic thermal management system for mobile SoCs, as well as power gate technology for every CPU and even inside the GPU, allowing power to be switched off, cutting leakage at the source. 

Body Biasing would also give Samsung a differentiating factor from the likes of Intel, which doesn’t use the technology. Body Biasing can be used to either speed up a transistor when full throttle is needed, increasing leakiness slightly, or it can slow the transistor down, stemming leakage for a more optimal low power state. 

However, whether customers will be enticed or not remains to be seen. 
This data is provided by hqew.net 

MediaTek’s Chipset will Drive the Shipment of Smartphones

MediaTek Inc was founded on May 28, 1997. It is headquartered in Hsinchu Science Park located in Hsinchu, Taiwan. Its sales and research subsidiaries are located in China, Singapore, India, Japan, South Korea, USA, Denmark, and England. It is a fables semiconductor company, which is specialized in designing and selling components. The components are used for wireless communication, optical storage, GPS, high-definition digital TV and DVD products. 

The latest silicon chipset platform of MediaTek has been developed for mid and entry level Android smartphones. The MT6575 platform owns a 1GHz ARM Cortex A9 processer, 3G/HSPA modem. It runs the latest “Ice Cream Sandwich” Android 4.0 release. For mid range smartphones, the MT6575 platform supports 720p high definition video playback and recording with an 8MP camera and qHD (960x540) high resolution displays via a PowerVRTM SGX Series5 GPU (graphics processing unit) from Imagination Technologies. 

Cortex A9 processor has powered many updated and highest performance smartphones. Cortex A Series processors’ improvement into lower cost, mainstream mobile device can offer a significant uplift for the user experience. The shipment of smartphone is expected to be 551 million with this segment in the year of 2016. Approximately 75% of those entry and mid level smartphones are expected to ship to new emerging markets. The entry level smartphones with smaller display sizes, lower resolution, less memory and reduced multimedia requirements are also available with the chipset. The latest smartphones offered by many of MediaTek’s leading customers also use the MT6575. In the first quarter of 2012, the first smartphone models based on this new platform will appear on the market. 

WinSystems Power Supply Overview

WinSystems has introduced two small, convection cooled, AC/DC power supplies for embedded systems. One is the PS-RS25-5, which is a 25W unit capable of supplying +5Vdc at 5A while the 50W, PS-RS50-5, supplies +5Vdc at up to 10A. The short circuit and overvoltage protection will recover and return to normal automatically after the fault is removed. Both power supplies support 88 to 264VAC input from 47~63 Hz so that they can operate on AC mains in the world. The units operate from -20° to +70°C requiring no fan. 

The units are certified with EMI, and EMC standards. Both are UL60950-1 and TUV EN60950-1 approved. For EMI and conduction and radiation, each unit complies with EN55022 (CISPR22) Class B. Additionally both power supplies are compliant with EN61000-4-2, 3, 4, 5, 6, 8, 11: ENV50204, EN61000-6-2 (EN50082-2) heavy industry criteria A for EMS immunity. The smaller PS-RS25-5 measures only 79 x 51 x 28mm. The slightly larger PS-RS50-5 measures 99 x 97 x 36mm. 

Four different ordering options are provided for each power supply. These options come with a USA standard AC plug. The variations are defined by the DC harness for WinSystems’ embedded SBCs that conform to the PC/104, EPIC, EBX standards or with no DC harness at all. 


This data is provieded by the largest IC part inventory of www.hqew.net