8 Main features of integrated circuits IRFR120

The electronic component IRFR120 is under the catalogue of other integrated circuits. The third generation Power MOSFETs provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU, SiHFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 W are possible in typical surface mount applications.

IRFR120's features are as followed.

1.       Dynamic dV/dt Rating

2.       Repetitive Avalanche Rated

3.       Surface Mount (IRFR120, SiHFR120)

4.       Straight Lead (IRFU120, SiHFU120)

5.       Available in Tape and Reel

6.       Fast Switching

7.       Ease of Paralleling

8.       Lead (Pb)-free Available

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