Two Main Applications Promote MEMS Sensor Technology

Follow the development of MEMS and sensors, the MEMS sensors are used in many industries. But in generally speaking, two main application areas make it developing fast! They are automotive and consumer electronics.

In the field of consumer electronics, Nintendo has been used MEMS devices in Wii wireless game, it allows users to communicate with each other through sports and click on the screen and deal with demand on the screen. How it can do this? The principle is the movement (such as waving arms to imitate the movement of tennis racquet) turns into the game behavior on the screen. Earlier, Nintendo and ADI's ADXL330 iMEMS announced ADI accelerometer into Nintendo's Wii game console. The accelerometer helps Nintendo video games develop to a new level.

Now, most phones with MEMS accelerometers and gravity sensors to achieve the function of gyroscopes. For example, MEMS sensor is used in the iPhone. By rotating the perception of movement, iPhone can automatically change the display anyway, so that consumers are able to fit the horizontal and vertical angle to see the full page, or digital and pictures.

In automotive applications, the area used with MEMS sensors is more and more. Including airbags in automobile airbag sensors, suspension control, rolling and so on. It also includes automotive MEMS pressure sensor and automatic tire pressure monitoring system, MEMS pressure sensor suitable for any type of tire, the tire wall in the sense of laying a small piece of pressure sensitive chip, automatic measuring tire pressure, temperature, speed and other data, and the specific code used to send out. In addition, car navigation GPS signal compensation, the cylinder pressure measurements, and most of another automotive subsystem.

This article comes from Hqew.net, which has 9 years’ experience in electronic components trading. This B2B trading platform covers thousands of electronic components such as lm358, lm317, ne555, lm324, lm339, lm741 and lm386.

12-inch Wafer Gains More Opportunities for TSMC

When Texas Instruments Inc. (TI) is running through the global analog IC market with its 12-inch wafer plan, the non-TI camp recently has been thinking of the new strategies to respond to TI’s action. The 12-inche analog process plant of Taiwan Semiconductor Manufacturing Company (TSMC) is considered as the most powerful weapon to compete with TI. It is said that many big oversea analog IC manufactures except TI has gone to Taiwan to discuss with TSMC the possibility to make analog ICs by using 12-inch, 90nm and even 65nm processes.

People familiar with electronic component industry said, though the use of advanced production process lines is hard to make the miniature analog IC, and cannot get the direct benefit of the grain size miniature, other competitors have been forced to seek Foreign aid at the same time when TI is continue to advertise the 12-inche wafer.And TSMC is almost the only option for the Non- TI makers.

According to the Taiwan-based analog IC designers, because their special IC circuits and more prominent linear features, the analog ICs are also use the process shrink for cost reduction actions, although the action is actually very slow, and even some special and ultra-high pressure analog ICs are still using the 5 inches and 6-inch, 0.5-micron process.

Even if Taiwan companies in recent years are successionally changing to the 8-inche, 0.35-micron process, faster as Newtouch the change level is only at 30 percent, while RichTek is below 30 percent, and other Taiwan-based analog IC suppliers are even lower than 10 percent. Therefore, we can see that advanced IC process technology does not play an absolute positive role on whether the analog IC is able to win in the terminal market.

As the world’s leading foundry, together with the internal high voltage input and BiCMOS, TSMC is no doubt to be favored by the oversea analog IC manufacturers sooner or later. Thus, TI’s advertising actions for 12-Inch wafer is just making TSMC the beneficiary of such movements involving the 12-Inch wafer. Following the research and development movements of international analog IC manufacturers, Taiwan-based analog IC supplier is continuing to upgrade it IC production lines. The actions that moving the No.1 factory (6- inch plant) to other 8-inch plant having more advanced process makes the TSMC wins its way from 8-inch plant all the way straight to the 12-inch wafer area and even gains TSMC a complete victory in all analog IC suppliers both home and abroad that see TSMC triumphalist and the only technology partner.

 The above article comes from Hqew.net, the electronic component trading platform which supplies you the most hot sale and in-stock ic components such as ne555, lm324, and lm339, for more click the link above.

The Future for 3D TVs

According to IHS iSuppli research, being influenced by price falling and 3D format supporting, the shipment of the global 3D TVs has increased 463% and reached to 23.4 million units in 2011. It is expected that this developing trend will continue and in 2012, the shipment of 3D TV will add up to 54.2 million units, which has grown 132% by comparing with the 2011’s. Meanwhile, in 2014, it is supposed that the shipment of the global 3D TV will be above 100 million units, while it will achieve 1.592 million units in 2015.

"Brands are marketing 3D not as a must-have electronic component technology but as a desirable feature, similar to the approach they have taken with Internet connectivity," said Riddhi Patel, IHS iSuppli’s director for television systems and retail services. Patel further noted that manufacturers believed that this approach to promote 3D allows consumers to decide whether they wish to use the feature when they are ready, while convincing them that their newly purchased television is future-proofed.

Meanwhile, it is reported that the viewing glasses are improving now. However, although the glasses and technology are better now, lots of consumers expressed that they were still not buying a 3D TV, but appreciated this changing course. What’s more, the changing course, to promote 3D as a feature, is absolutely a move in the right direction and it’s better than building 3D as a distinct product category.

Additionally, from the business standpoint, manufacturers will benefit a lot from this changing course. According to IHS iSuppli research:

Liquid crystal display (LCD), which accounts for 83% of 3D TVs sold in 2011, is still 3D TV market’s dominant technology. In the coming years, the 3D TV share of the global flat-panel market will continue to rise, jumping to 11% in 2011 from 2% last year, and then doubling next year to 22%. By the year of 2015, 3D TVs will account for 52% of flat-panel shipments.

In order to attract more consumers to buy 3D TVs, manufacturers are slashing prices. According to the US TV Price and Specifications Tracker, a monthly IHS iSuppli service which tracks US TV prices, prices for 3D TVs fell 9 percent during March 2011 by comparing to February’s. In the next year, prices will change continuously based on the feature mix which dictated by public preferences. Moreover, this process is expected to democratize 3D adoption among consumers in all income brackets.

The above are all good changing aspects, but 3D TVs still meet a problem, the glasses’ problem. Besides its high price, the look of the glasses is so odd that quite an amount of consumers do not like them. Furthermore, it is a fact that lots of people have a trouble in finding the remote control for the TV, but now, they have to find another thing—the glasses. What a big trouble for them!

The above article comes from Hqew.net, the electronic component trading platform which supplies you the most hot sale and in-stock ic components such as ne555, lm324, and lm339, for more click the link above. 

NXP Semiconductor 74HC373

Recently the price of the electronic component 74HC373 from NXP is quite stable due to its adequate supply.

The 74HC373; 74HCT373 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL. It is specified in compliance with JEDEC standard no. 7A.

The 74HC373; 74HCT373 is an octal D-type transparent latch featuring separate D-type inputs for each latch and 3-state outputs for bus oriented applications. A latch enable (LE) input and an output enable (OE) input are common to all latches.

The 74HC373; 74HCT373 consists of eight D-type transparent latches with 3-state true outputs. When LE is HIGH, data at the Dn inputs enters the latches. In this condition the latches are transparent, i.e. a latch output will change state each time its corresponding D input changes.

When LE is LOW the latches store the information that was present at the D inputs a set-up time preceding the HIGH-to-LOW transition of LE. When OE is LOW, the contents of the 8 latches are available at the outputs. When OE is HIGH, the outputs go to the high- impedance OFF-state. Operation of the OE input does not affect the state of the latches.

The 74HC373; 74HCT373 is functionally identical to:

• 74HC563; 74HCT563: but inverted outputs and different pin arrangement

• 74HC573; 74HCT573: but different pin arrangement

Features and benefits

1.    3-state non-inverting outputs for bus oriented applications

2.    Common 3-state output enable input

3.    Functionally identical to the 74HC563; 74HCT563 and 74HC573; 74HCT573

4.    ESD protection:

5.    HBM JESD22-A114F exceeds 2 000 V

6.    MM JESD22-A115-A exceeds 200 V

7.    Specified from −40 °Cto+85 °C and from −40 °Cto+125 °C

Analysis of the latest market price of the transistor KSP2222

Category: Transistors 

Brand: FSC 

Package: TO-92 

Parameters: 

Material: Si 

Structure: npn 

Maximum collector power dissipation (Pc): 625mW 

Maximum collector, base voltage (Ucb): 60V 

Maximum collector-emitter voltage (Uce): 30V 

Largest emitter base voltage (Ueb): 5V 

Maximum collector current (Ic max): 600mA 

The maximum junction temperature KSP2222 (Tj): 150 ° C 

Transition frequency (ft): 250MHz 

Collector capacitance (Cc), Pf: 8 

Forward Current Transfer Ratio (hFE), min / max: 100MIN 

The recent searches for transistor KSP2222 on majore electronic components trading websites are increasing over the previous few months, but offers from merchants online are relatively fewer, according to the market survey. Stock for this product is quite adequate, and it won’t be out of stock temporarily. Some said that a price bullish is quite possibly seen, and there is currently a imported chips packaged by China manufacturers on sale, price of this product is much more lower, which is around 0.05-0.07 yuan /pcs, quite a high capability price ratio chip.

TJA1050T/N1: The Third Philips High-speed CAN Transceiver

The component TJA1050T/N1, one of the TJA1050 family is in widely use in electronic component field.
The TJA1050 is the interface between the Controller Are Network (CAN) protocol controller and the physical bus.The device provides differential transmit capability to the bus and differential receive capability to the CAN controller.
The TJA1050 is the third Philips high-speed CAN transceiver after the PCA82C250 and the PCA82C251.
The most important differences are:
• Much lower electromagnetic emission due to optimal matching of the output signals CANH and CANL
• Improved behaviour in case of an unpowered node
• No standby mode.
This makes the TJA1050 eminently suitable for use in nodes that are in a power-down situation in partially powered networks.

Features and benefits of this TJA1050 family：
• Fully compatible with the “ISO 11898” standard
• High speed (up to 1 Mbaud)
• Very low ElectroMagnetic Emission (EME)
• Differential receiver with wide common-mode range for high ElectroMagnetic Immunity (EMI)
• An unpowered node does not disturb the bus lines
• Transmit Data (TXD) dominant time-out function
• Silent mode in which the transmitter is disabled
• Bus pins protected against transients in an automotive environment
• Input levels compatible with 3.3 V and 5 V devices
• Thermally protected
• Short-circuit proof to battery and to ground
• At least 110 nodes can be connected.

2SB772: PNP Medium Power Transistor

The product 2SB772 newly in stock on Hqew.net is a PNP medium power transistor. This electronic component is a PNP transistor manufactured by using planar Technology resulting in rugged high performance devices. The complementary NPN type is 2SD882.

Features

1.       High current

2.       Low saturation voltage

3.       Complement to 2SD882

Applications

1.       Voltage regulation

2.       Relay driver

3.       Generic switch

4.       Audio power amplifier

5.       DC-DC converter